| 摘要 |
According to this invention, a semiconductor device includes a plurality of lead frames (11, 11) on which at least one semiconductor pellet (21, 21) is formed, a dummy pellet (8) formed on at least one of the plurality of lead frames (11, 11), wires (31, 32) for connecting electrodes (41, 42) of the semiconductor pellets (21) 22) with electrodes of the dummy pellet (8). |
