MANUFACTURING METHOD OF CIRCUIT BOARD HAVING SOLDER THROUGH HOLE

摘要

The invention provides a method for preparing a printed circuit board with solder plated circuit and through-holes, using a specifically prepared photoresist material and a combination of exposure, development, solder plating and etching means. This method is particularly useful for the preparation of a printed circuit-board with solder plated circuit and through-holes bearing a high density circuit pattern.