Conducting pathway layer structure for PCBs - comprising electrically conducting metallic conducting layers sepd. by metallic diffusion barrier layer

摘要

Conducting pathway layer structure comprises at least 2 elecrtrically conducting metallic conducting layers sepd. by at least one metallic diffusion barrier layer. The novelty is that the metals used in the barrier layer and in the conducting layers have different crystal lattice structures. The activation energies of the metals used in the diffusion barrier layer are higher than those used in the conducting layers. Also claimed is a PCB made of the above layer structure. ADVANTAGE - Diffusion between the conducting layers is eliminated.