| 发明名称 |
RESIN SEALED TYPE SEMICONDUCTOR DEVICE AND PRODUCTING METHOD OF THE SAME |
| 摘要 |
A plastic molded semiconductor device having a semiconductor chip mounted on a die pad supported by hanging pins. The semiconductor chip is encapsulated by mold plastic where the semiconductor chip has a lead portion protruding to a side, and in which practically the entire periphery of the semiconductor chip is covered by aluminum or some other moistureproof material that stops the entry of moisture. |
| 申请公布号 |
KR930010071(B1) |
申请公布日期 |
1993.10.14 |
| 申请号 |
KR19900014529 |
申请日期 |
1990.09.14 |
| 申请人 |
TOSHIBA CO., LTD. |
发明人 |
KAZUMATA, AKIO;FUJIETA, SHINETSU;SHIMOJAWA, HIROSHI;HIRATA, SEIICHI |
| 分类号 |
H01L21/56;H01L23/00;H01L23/16;H01L23/28;H01L23/29;H01L23/31;(IPC1-7):H01L23/04 |
主分类号 |
H01L21/56 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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