| 摘要 |
<p>The wiring substrate 1 of the present invention serves for the mounting of a plurality of elements 2 of an electronic circuit and comprises a ceramic layer section 11, a plurality of wiring layers 17 formed on the section 11; a plurality of first insulating layers 16 made from polyimide resin so as to form an insulation between the wiring layers; a second insulating layer 18 formed on the topmost layer of the wiring layers and made from a polyimide material mixed with a mineral powder and a plurality of bonding pads 19 formed on the second insulating layer. This arrangement enables the circuit elements to be mounted using a thermocompression bonding technique. <IMAGE></p> |
