COOLING APPARATUS AND SEMICONDUCTOR DEVICE EMPLOYING THE SAME

摘要

A heat conducting member 3 is placed in the space between a semiconductor chip 11 which generates heat and a heat transfer block 1 which is cooled by a coolant, and the heat conducting member conducts heat from the semiconductor chip to the heat transfer block. The heat conducting member has a slanted surface which is inclined with respect to a surface to be cooled of the corresponding semiconductor chip. Even when the semiconductor chip is displaced or inclined with respect to the heat transfer block, the whole of the cooling surface of the semiconductor chip can be kept in contact with the corresponding heat conducting member.