| 摘要 |
PURPOSE:To enable the execution of solder plating of a lead frame in a short period of time at a uniform film thickness. CONSTITUTION:A frame part 10 of the lead frame is completely covered with electrodes 12 in a power feed section 20 and is further covered with nonmetals 14 so as not to be stuck with solder. Only the outer lead part 16 is opened and a nozzle 18 is disposed in such a manner that its front end faces the outer lead part 16. The electrodes 12 and solder electrodes 22 are electrically connected and the power feed section 20 is immersed into a plating cell 26 contg. a plating liquid 24. A current is then passed from a power source 28. The power source 30 of the nozzle 18 is turned on simultaneously therewith and the plating liquid is applied from the nozzle 18 to plate the outer lead part 16. A baffle 32 is disposed on the rear side of the lead frame in such a manner that the plating of the similar film thickness sticks to the rear side of the lead frame as well. |
