发明名称 |
Process for producing a printed wiring board |
摘要 |
A process for the production of a printed wiring board, which comprises preparing a copper-clad laminate having a through-hole formed by drilling; providing a first resist pattern on the surface of the copper-clad laminate so as to cover a portion to be formed as a conductor pattern; etching the copper-clad laminate; removing the first resist pattern; subjecting the whole laminate to an electroless copper plating; laminating a dry film resist on the copper-clad laminate; exposing and developing the dry film resist to form a second resist pattern in such a manner that the through-hole and a portion to be plated are exposed; subjecting the exposed portions to an electrolytic copper plating; removing the second resist pattern; and removing the exposed electroless copper plating through etching.
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申请公布号 |
US5252195(A) |
申请公布日期 |
1993.10.12 |
申请号 |
US19920980313 |
申请日期 |
1992.10.28 |
申请人 |
MITSUBISHI RAYON COMPANY LTD. |
发明人 |
KOBAYASHI, TADASHI;UCHIDA, HIROYUKI;SHIMODA, HIDETOSHI;TAKAHASHI, TOSHIO |
分类号 |
H05K3/42;(IPC1-7):C25D5/02 |
主分类号 |
H05K3/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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