Wire bonding method and apparatus

摘要

A wire bonding method and apparatus for welding a wire with at least one end formed with a ball and a pad of a printed wiring board. A bonding head moves downward slowly to crush the ball to form a flat surface, and will move upward once to adjust a relative position of the pad and the ball. The bonding head will move downward again, and an ultrasonic wave is applied to heat the ball and the bonding head so that the ball and the pad are welded. If necessary, a portion of the wire to be bent is moved to a desired position of the wiring board, by a supporting apparatus. A free end of the wire which is not welded is moved by a jig to bend the portion of the wire for routing.