发明名称 |
Flexible coverstock semi-rigid foam void test mold |
摘要 |
A test mold assembly for evaluating the surface deformation tendency of a coverstock bonded to a reactive plastic formulation to voids in the formulation including a base adapted to support a coverstock and spaced side walls extending upwardly from the base to define a mold cavity for receiving foam precursors. The assembly further includes a lid adapted to form the top of the mold cavity and having a cover portion disposed spaced from the base. The lid includes a plurality of integral projections extending downwardly from the cover portion into the mold cavity a predetermined distance to create voids in the foam. A method of making a foam void model for evaluating the surface deformation tendency of a coverstock bonded to a reactive plastic formulation to voids in the formulation is also disclosed.
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申请公布号 |
US5251866(A) |
申请公布日期 |
1993.10.12 |
申请号 |
US19910779813 |
申请日期 |
1991.10.21 |
申请人 |
DAVIDSON TEXTRON INC. |
发明人 |
LORD, ELLEN;VANBENSCHOTEN, BRIAN;DURAND, DANIEL |
分类号 |
B29C33/00;B29C37/00;B29C44/58;B29C70/78;(IPC1-7):B22D19/00 |
主分类号 |
B29C33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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