| 摘要 |
PURPOSE:To electrically separate a semiconductor element from other semiconductor elements and independently measure characteristic of semiconductor elements by connecting the circuits of predetermined semiconductor elements formed on semiconductor main surface through the outer most layer wiring and forming such outer most layer wiring with wiring for master slice. CONSTITUTION:In an internal element 1, a contact in the region for configurating this element is electrically connected to a first layer wiring 7 through a wiring 3, a through hole 4, a second layer wiring 5 and a through hole 6 and the internal element 1 is connected with other internal elements of the circuit in order to show circuit function. Here, the second layer wiring 5 is changed to the second layer wiring 8 for master slice in order to measure the characteristic of the internal element 1. Thereby, the internal element 1 is separated electrically from the internal circuit and characteristic of internal element 9 can be measured independently and accurately. |
