发明名称 |
Conductive metal-filled substrates via developing agents |
摘要 |
A conductive metal-filled substrate is formed by intermingling copper or nickel particles into the substrate, contacting the metal particles with a specified developing agent, and heating the metal particles and the developing agent. The filled substrates are electrically conductive and are useful for a variety of uses such as EMI shielding.
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申请公布号 |
US5252255(A) |
申请公布日期 |
1993.10.12 |
申请号 |
US19900521772 |
申请日期 |
1990.06.11 |
申请人 |
AKZO AMERICA INC. |
发明人 |
MOY, PAUL Y. Y.;PARR, WILLIAM J. E.;FRANK, DIETER;HUTTON, RONALD E. |
分类号 |
C08K3/08;H01B1/22;H05K9/00;(IPC1-7):H01B1/00;H01B1/02;H01B1/20 |
主分类号 |
C08K3/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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