发明名称 |
Copper electroplating solutions and processes |
摘要 |
Compositions and processes for electrolytic plating. The compositions are characterized by critical amounts of one or more brightening and leveling agents. The compositions are particularly useful for plating through hole walls of printed circuit boards, including through holes having an aspect ratio equal or greater than about ten to one.
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申请公布号 |
US5252196(A) |
申请公布日期 |
1993.10.12 |
申请号 |
US19910803281 |
申请日期 |
1991.12.05 |
申请人 |
SHIPLEY COMPANY INC. |
发明人 |
SONNENBERG, WADE;FISHER, GORDON;BERNARDS, ROGER F.;HOULE, PATRICK |
分类号 |
C25D3/38;(IPC1-7):C25D3/38 |
主分类号 |
C25D3/38 |
代理机构 |
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代理人 |
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地址 |
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