| 摘要 |
A mold (10) for the manufacture of integrated circuit packages (1) of plastics, incorporating a heat sink (3,8), comprises a first half-shell (11) having a rest bottom (12) for the heat sink (8), which is associated with a metal frame (7) having a central portion carrying the integrated circuit and being held by filaments (4A), and a second half-shell (13) arranged to overlie the first (11) and having at least one elevated portion (16) which will compress said filaments (4A) on the half-shells (11,13) being laid over each other. <IMAGE> <IMAGE> |
