发明名称 |
Semiconductor device having stacked lead structure |
摘要 |
Disclosed is a resin-molded type semiconductor device having a thin package while avoiding short-circuit of wires with a common inner lead. In the construction thereof, a common inner lead constituted by a thin metal sheet is fixed onto a circuit-forming surface of a rectangular semiconductor chip substantially in parallel with longer sides of the chip and substantially in a central region of the chip, and a plurality of inner leads for signals, which are in the form of a frame, are stacked and fixed onto the common inner lead; then these components are molded with resin.
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申请公布号 |
US5252854(A) |
申请公布日期 |
1993.10.12 |
申请号 |
US19910717262 |
申请日期 |
1991.06.18 |
申请人 |
HITACHI, LTD.;HITACHI MICROCOMPUTER |
发明人 |
ARITA, JUNICHI;IWAYA, AKIHIKO;MATSUZAWA, TOMOO;ICHITANI, MASAHIRO |
分类号 |
H01L21/60;H01L23/495;H01L23/50;(IPC1-7):H01L23/02 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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