| 摘要 |
<p>PURPOSE:To produce an IC card through a simple and reliable manufacturing process. CONSTITUTION:A base material 4 is formed by placing a protective sheet 1 on an inner face in a cavity with a card shape in a mold, placing thereon a wiring sheet 3 on which IC chips 2 have been wired and injecting an ABS resin in the cavity from a gate. Faces of the protective sheet 1 and the wiring sheet 3 exposed in the space of the cavity part are heat-sealable layers and they are bonded with the base material 4 by heat of the injected resin and each member is bonded each other to form an IC card with a defined mutual position and with good accuracy. In addition, as the protective sheet 1 protects the IC chips 2 and the wiring sheet 3 from impact in the following processes, generation of defective devices can be prevented.</p> |
