| 摘要 |
PURPOSE:To decide nondefective or defective IC chips easily regarding each IC chip loaded on a hybrid integrated circuit device. CONSTITUTION:In the multi-chip module 1, a plurality of IC chips 2 are loaded onto a multilayer interconnection board 3, in which main wirings are formed to internal layers, and the IC chips 2 are connected electrically to the main wirings. Test pads 4 and connecting pads 5 are disposed near the IC chips 2, the connecting pads 5 and a solid pattern 7 are bonded through vias 8a at the same time, and the test pads 4 and the vias 8a are spliced through resistance layers 10a, 10b while the test pads 4 and the IC chips 2 are bonded and connected. The solid pattern 7 is supplied with voltage, and voltage among the test pads 4 and the connecting pads 5 is measured. The test pads 4 and the connecting pads 5 are wire-bonded after measurement. |
