| 摘要 |
<p>PURPOSE:To obtain a method for manufacturing a printed wiring board on which a very fine pattern can be formed with high precision and surface mount type electronic part with narrow pitches and multi-pins can be mounted at high density in a stable state in spite of massproduction-like process. CONSTITUTION:Removable plating resist of an inverse circuit made of photosensitive resin is formed on the main surface of a conductive supporting board, and a circuit pattern is formed by copper-electroplating on the exposed surface of the board. Next, the plating resist mask is removed, and a plating resist film made of photosensitive resin is formed again and then a copper plating layer 5 is formed, and the inverse circuit pattern of the removable resist film 6 is formed, and further a copper-plating layer 7 and a solder plating layer 8 are sequentially formed, and then the removable resist film 6 is removed. Using the solder plating layer 8 as an etching resist layer, the chemical copper- plating layer 5 is removed by etching to form a required circuit pattern layer and then the solder plating layer is removed.</p> |
