| 摘要 |
PURPOSE:To enable high-density mounting of electronic components on a wiring board thereby to miniaturize electronic equipment, by mounting another electronic component on an electronic component mounted on the wiring board by die bonding. CONSTITUTION:A first integrated circuit die 1 is connected to the upper surface of a wiring board 3 by bumps 5 for flip chip mounting. The pattern side of the integrated circuit die 1 is facing the wiring board 3. A second integrated circuit die 2 is mounted on the rear of the integrated circuit die 1 so that the rear of the integrated circuit die 2 is put in contact with the rear of the integrated circuit die 1. The integrated circuit die 2 and the wiring board 3 are connected through bonding wires 4. The connection of the bonding wires 4 to the wiring board 3 is made to the grand pads 11 on the wiring board 3. This enables increase in the mounting density of electronic components per unit area on the wiring board 3 and miniaturization of electronic equipment. |
