| 摘要 |
<p>PURPOSE:To form a coating film uniform in thickness throughout the surface of a substrate by a method wherein coating solution is dripped on the center of the semiconductor substrate, and then solvent is dripped on the center of the substrate at the same time when the semiconductor substrate is made to start rotating. CONSTITUTION:A prescribed amount of coating solution 5 is dripped on the center 1a of a substrate 1 from an applicator nozzle 4. In succession, the applicator nozzle 4 is moved to the side from the center 1a, and then a solvent nozzle 7 is positioned at the center 1a of the substrate 1. A rotary pad 2 is rotated at a high speed through the intermediary of a spindle shaft 6, and a prescribed amount of solvent 8 is dripped on the center 1a of the rotating substrate 1. After a prescribed time is elapsed, a spin coating process is finished by stopping the rotary pad 2, and the solvent nozzle 7 is moved aside to a prescribed place. By this setup, a coating layer 5a uniform in thickness throughout the whole surface of a substrate can be formed.</p> |
