| 摘要 |
<p>PURPOSE:To realize easy facedown bonding of a semiconductor chip and a substrate with high position accuracy. CONSTITUTION:A projection part 4 which is used solely for positioning is provided to an electrode surface side of a semiconductor chip 1. A recessed part 9 corresponding to the projection part of the chip is provided to a mounting circuit substrate side. Positioning is completed readily by fitting of the recessed and projecting parts. Thereby, the following can be realized; (1) Positioning of registration deviation of 3mum. (2) Easy adjustment of positioning and high precision positioning mounting in multilayer lamination. (3) Assembly of good position accuracy with a substrate pattern even if position deviation exists between a chip electrode pattern and a chip external shape.</p> |
