| 摘要 |
PURPOSE:To obtain the microstrip coupler not requiring the chip cutoff process and the externally mounted capacitor bonding/wire bonding process or the like and suitable for mass-production. CONSTITUTION:A coupling microstrip line 7 and a non-coupling microstrip line 9 of the coupler are connected by using wires 22, 33 formed between a semiconductor board and an insulation layer through the adoption of the 2-layer wire structure for the microstrip coupler. Thus, the effect of a difference between phase constants in the propagation mode is eliminated by keeping the potential of the coupling microstrip line 7 and the non-coupling microstrip line 9 the same and utilizing a parallel plate capacitance of the 2-layer wire structure. |
