SHAPE OF WIRING IN SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE,申请号JP19920058222-传众专利搜索

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发明名称	SHAPE OF WIRING IN SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
摘要
申请公布号	JPH05259159(A)	申请公布日期	1993.10.08
申请号	JP19920058222	申请日期	1992.03.16
申请人		发明人
分类号	H01L21/3205;H01L23/52;(IPC1-7):H01L21/320	主分类号	H01L21/3205
代理机构		代理人
主权项
地址

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