| 摘要 |
<p>PURPOSE:To prevent the existence of the remainder of a bonding agent within an active region of an element by irradiating an inactive region at the end portion of the element with an ultraviolet beam through a mask on the occasion of peeling a protection sheet (UV shrink sheet) with heat in view of preventing contamination at the time of dicing. CONSTITUTION:Under the condition that a protection sheet (UV shrink sheet) 3 is sticked to a semiconductor wafer 7, the dicing is carried out. Thereafter, a water is covered with a mask 1 having a shielding part 2 which is not irradiated with the ultraviolet beam and is then irradiated with the ultraviolet beam. Thereby, the heat is applied to the sheet, the sheet is curled from the side opposed to the region not irradiated with UV beam. Accordingly, the remainder of bonding agent of the sheet is eliminated from the active region of the element, reducing the failure rate of element.</p> |
