| 摘要 |
PURPOSE:To provide a multi-chip module formed in constitution, in which heat- dissipating characteristics, etc., are improved and an excellent function required can be displayed at all times. CONSTITUTION:A seal ring 9 is mounted integrally to the peripheral section of the main surface of a ceramic multilayer wiring board 1, and through-holes 10 and a polyimido resin insulating layer - a conductor pattern layer group thin-film multilayer interconnection section 2 are formed to the wiring board 1. The through-holes 10 are penetrated and sealed in an airtight manner and a thermal conductive block 11 is buried so that one end face is formed in aproximately the same surface as the surface of the wiring board 1 or the surface of the interconnection section 2, and a semiconductor element 4 is loaded and arranged onto one end of the block 11, and connected to the interconnection section 2 while the opening edge section 6a of a metallic cap 6 is sealed to the surface of the seal ring 9 in the airtight manner. Radiation fins 8 are disposed integrally onto the other end face of the block 11 led out to another main surface side or the wiring board 1. |
