| 摘要 |
PURPOSE:To mount a package made of a resin positively in a previously designed position or direction by fitting the package made of the resin to a previously fixed support means and disposing the package and the support means upright on a circuit board. CONSTITUTION:Sections to be supported 13 are set up in two positions on both sides of connecting leads 12 in the joining edge section 11a of 8 package 11 made of a resin. Support means 14 are fixed previously onto a circuit board, to which a semiconductor device 10 must be disposed upright. The semiconductor device 10 is disposed upright on the circuit board by fitting the sections to be supported 13 of the package 11 made of the resin to the support means 14. The position of erection and direction of erection of the semiconductor device 10 are specified according to how the support means 14 are fixed onto the circuit board at that time. Consequently, the resin package can be mounted in a beforehand designed position or direction. |
