| 摘要 |
PURPOSE:To increase the degree of freedom of a design based on temperature characteristics while eliminating the need for a thermostatic chamber even when the range of a working temperature is limited. CONSTITUTION:A first metal plate 2 and a second metal plate 3 joined so as to have a Peltier effect are fixed onto a package 1 with terminals 8A-8F, and a semiconductor chip 4 is loaded onto the second metal plate 3. Currents are made to flow through a metal joining section 9 by using electrodes 6, 7. |
