Verfahren und Vorrichtung zum Formen von Stiften aus extrudierbarem Material in einem Substrat.

摘要

Method and apparatus utilizing the known technique of extrusion to form a plurality of very small pins, with diameters of 0,5 mm or smaller, in a substrate (14) of electrically nonconductive material. The number of pins is 360 or more, and the electrically conductive material described in the extrusion process is copper. A pin die (12) is formed with the same number and pattern of holes as are in a blank substrate, and it is positioned over an extrusion die (13) with matching orifices (19, 20) that is fixed on an extrusion press (46). A head die (11) presses the blank substrate firmly on the pin die during the extrusion operation, and when completed, the pins are sheared and the substrate is ejected as a new blank is positioned to repeat the cycle.