发明名称 |
METHOD OF FORMING A CONTACT BUMP USING A COMPOSITE FILM |
摘要 |
<p>Composite film, method of forming transferred bump using the film, probe card structure obtained using the film, and process for peoducing the probe card structure using the film and the transferred bump-forming method are disclosed. The composite film comprises an insulating film and a metallic material extending from the front to the back side of the insulating film through a through-hole formed in the insulating film, said metallic material projecting from the insulating film on at least one side thereof and being releasable from the insulating film. <IMAGE></p> |
申请公布号 |
EP0544305(A3) |
申请公布日期 |
1993.10.06 |
申请号 |
EP19920120222 |
申请日期 |
1992.11.26 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
OUCHI, KAZUO;SUGIMOTO, MASAKAZU;TANAKA, MUNEKAZU;AMINO, ICHIRO;MORITA, SYOJI |
分类号 |
H01L21/48;H01L21/60;H01L21/68;H01L23/485;H05K3/34;H05K3/40;(IPC1-7):H01L23/498 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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