| 摘要 |
<p>PURPOSE:To improve the commonness when outer shape dimensions are different by a method wherein a semiconductor device is put in a storage part, and this storage part is fitted in a recessed part which is formed on the storage container main body. CONSTITUTION:A large sized QFP type semiconductor device is put in a storage part 12, and a small sized QFP type semiconductor device is put in a storage part 13 respectively. In this case, the outside dimensions of both storage parts 12, 13 are made to be the same, and the inside dimensions for storage are made to correspond with respective semiconductor devices. Then, recessed parts 11A, in which the storage parts 12, 13 are fitted in, are formed on a storage container 11. Since the outer diametrical dimensions of respective storage parts 12, 13 are the same, the dimension of the recessed part 11A is uniform, and the outer diametrical dimension, storage pitch and number of storage parts of the storage container 11 are unified. Therefore, the storage container becomes easier to deal with the handling by an automatic machine or to cope with the existence of a fin on the semiconductor device, etc.</p> |
