| 摘要 |
PURPOSE:To prevent the crack of a resin molded object and to enhance the surface accuracy thereof by easily releasing the molded object by setting the temp. of a mold to 20-40 deg.C within one min after the cell cast polymerization of the molded object is completed. CONSTITUTION:When a resin molded object molded by cell cast polymerization is released, the temp. of a mold is lowered to 20-40 deg.C within one min to release the molded object by a heat shock. When the temp. of the mold is lowered to below 20 deg.C, the molded object is not released and, when the temp. of the mold exceeds 40 deg.C, the mold generates a crack. The temp. of the mold is lowered by dipping the whole of the mold in a large container filled with a liquid whose temp. is 20-40 deg.C lower than the temp. of the mold to uniformly cool the same. The dipping time of the whole of the mold is set to 10 sec or less so as to prevent the partial release of the molded object to generate no crack in the molded object. No scaly release mark is also generated on the surface of the molded object. |
