| 摘要 |
<p>PURPOSE:To provide a tool for the heat-treatment of semiconductor wafers and its production process to enable the treatment of a large-sized semiconductor wafer and a number of wafers at the same time and giving a treated product having excellent heatresistance and high purity without causing the contamination of the semiconductor wafer at a high temperature. CONSTITUTION:The objective tool for the heat-treatment of semiconductor wafers is composed of a synthetic quartz glass having an OH concentration of <=200ppm, a Cl concentration of >=20ppm and a viscosity of >=1.0X10<13> poise at 1200 deg.C. The tool can be produced by hydrolyzing a silicon chloride in an oxyhydrogen flame to form a porous glass having a specific gravity of 0.4-0.6g/cm<3> and composed of glass particles having an average particle diameter of <=0.4mum and heat-treating the porous glass at 1000-1500 deg.C in hydrogen atmosphere.</p> |
