| 发明名称 |
Solder interconnection structure |
| 摘要 |
Solder interconnection whereby the gap created by solder connections between a carrier substrate and semiconductor device is filled with a composition obtained from curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof; filler having a maximum particle size of 31 microns and being at least substantially free of alpha particle emissions. |
| 申请公布号 |
US5250848(A) |
申请公布日期 |
1993.10.05 |
| 申请号 |
US19910737473 |
申请日期 |
1991.07.30 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CHRISTIE, FREDERICK R.;PAPATHOMAS, KOSTAS I.;WANG, DAVID W. |
| 分类号 |
H01L21/56;H01L21/60;H01L23/29;H05K3/28;H05K3/34;(IPC1-7):H01L23/48;H01L29/40;H01L29/64;H01L39/02 |
主分类号 |
H01L21/56 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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