发明名称 Conductive polymer composition
摘要 A conductive polymer composition in which a particulate conductive filler is dispersed in a polymeric component which is a mixture of an essentially amorphous thermoplastic resin and a thermosetting resin. In preferred compositions, the amorphous thermoplastic resin and the thermosetting resin are substantially mutually soluble. In order to improve the thermal stability of the composition on exposure to successive thermal cycles, it is preferred that the composition be cured by heating the uncured mixture of amorphous thermoplastic resin, thermosetting resin, and particulate conductive filler at a rate of at least 15 DEG C./minute to the cure temperature.
申请公布号 US5250228(A) 申请公布日期 1993.10.05
申请号 US19910788655 申请日期 1991.11.06
申请人 RAYCHEM CORPORATION 发明人 BAIGRIE, STEPHEN;CHU, EDWARD F.;PARK, GEORGE B.;REDDY, VIJAY N.;RINDE, JAMES A.;SALTMAN, ROBERT P.
分类号 C08K3/04;C08K3/08;H01B1/22;H01B1/24;H01C7/02;(IPC1-7):H01B1/00;H01B1/70 主分类号 C08K3/04
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