SEMICONDUCTOR DEVICE

摘要

A semiconductor device has a semiconductor element having a large number of pads. A wiring board is provided on the top surface thereof with a large number of radially extending wiring patterns. The semiconductor element is mounted centrally on the top surface of the wiring board. A lead frame is secured to the outer edge of the wiring board and electrically connected to the wiring patterns. An anisotropic conductive film is provided between the wiring board and the lead frame or between the wiring board and input/output terminals of the semiconductor element to provide electrical connection therebetween. Also, the wiring patterns on the wiring board may be bonded directly to inner ends of the lead frame by hot pressing or by solder.