| 摘要 |
<p>A rotatable magnet configuration for use in a magnetron sputtering system for obtaining a desired sputter target erosion profile and for obtaining a sputtered film on a substrate having a desired film characteristic, such as uniformity of thickness, and a method of designing such a magnet configuration are disclosed. The disclosed design and method compensate for the discrepancy between the actual position of the magnet and the 'effective' position of the magnet as measured by a static erosion profile obtained holding the magnet stationary. The method shown describes how to adjust the actual shape of the magnet to obtain a desired effective shape that will produce a predetermined erosion profile in the sputter target. In addition, the disclosure describes how to determine an optimal erosion profile to produce a sputtered film having a desired characteristic.</p> |
