发明名称 LOW-NEIGHBORHOOD THREE-DIMENSIONAL INTERCONNECT
摘要 Circuit supporting modules form a three-dimensional communication interconnect mesh. Each module has fewer than six sets of connectors, preferably four. The preferred three-dimensional communication interconnect is a tetrahedral lattice having a regular, isotropic, three-dimensional topology in which each module connects to its four physically closest neighbors. The structure of the tetrahedral interconnect is isomorphic with a diamond lattice structure.
申请公布号 WO9319432(A1) 申请公布日期 1993.09.30
申请号 WO1993US02416 申请日期 1993.03.17
申请人 MASSACHUSETTS INSTITUTE OF TECHNOLOGY 发明人 WARD, STEPHEN, A.;PRATT, GILL, A.;NGUYEN, JOHN, N.;PEZARIS, JOHN, S.
分类号 G06F1/16;A63F9/24;G06F15/173;G06F15/80;H01R12/50;H01R31/06;H05K1/14;H05K7/02;H05K7/14 主分类号 G06F1/16
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