发明名称 |
LOW-NEIGHBORHOOD THREE-DIMENSIONAL INTERCONNECT |
摘要 |
Circuit supporting modules form a three-dimensional communication interconnect mesh. Each module has fewer than six sets of connectors, preferably four. The preferred three-dimensional communication interconnect is a tetrahedral lattice having a regular, isotropic, three-dimensional topology in which each module connects to its four physically closest neighbors. The structure of the tetrahedral interconnect is isomorphic with a diamond lattice structure. |
申请公布号 |
WO9319432(A1) |
申请公布日期 |
1993.09.30 |
申请号 |
WO1993US02416 |
申请日期 |
1993.03.17 |
申请人 |
MASSACHUSETTS INSTITUTE OF TECHNOLOGY |
发明人 |
WARD, STEPHEN, A.;PRATT, GILL, A.;NGUYEN, JOHN, N.;PEZARIS, JOHN, S. |
分类号 |
G06F1/16;A63F9/24;G06F15/173;G06F15/80;H01R12/50;H01R31/06;H05K1/14;H05K7/02;H05K7/14 |
主分类号 |
G06F1/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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