| 摘要 |
<p>PURPOSE:To obtain a protective film having high reliability and rigid adherence by forming a layer made of Al2O3, Cr2O5 or TiO2 on the surface of a semiconductor element and sealing it with polyquinoxaline resin. CONSTITUTION:Polyquinoxaline resin has excellent heat resistance and moisture resistance, and is rigidly adhered to silicon oxide, nitride or metal. When Al2O3, Cr2O5, TiO2 or the like is interposed between the polyquinoxaline resin and semiconductor element surface, the adherence of the resin can be further improved. According to this configuration extremely high reliable device can be obtained. The resin coating can be dropped, for example, on the element and its periphery carrying m-cresol solution of polyquinoxaline resin on the substrate and thermally cured.</p> |
