Dry binder for chip board - based on dry resins or catalyst - free aq soln of melamine resin

摘要

Mouldings or panels of chip-board with little or no bubbling, low hygroscopy, good resistance to wear, acids and alkalis made by using as binder either dry chips or films or urea, phenol, malemine or resorcinol resins (mixing equal proportions of wood and resin chips and forming the article at 150 degrees C at 250 kg/cm2) or spraying onto the wood-chips a catalyst-free aq. soln. of pure melamine resin (6 wt. parts resin to 4 wt. parts water), drying the coated chips and forming the article at 160 degrees C under 300 kg/cm2. About 150 ml soln. are sprayed onto 100 g dried wood-chips. A polyethylene glycol soln. can be added to the binder soln. to reduce the brittleness of the chip-board. Panels are esp. suitable for flooring.