| 摘要 |
<p>PURPOSE:To make possible compactness and multi-channeling appropriate to high density mounting by providing common lead wires on light-emitting and light-receiving lead frames, respectively. CONSTITUTION:At the time of producing an optically coupled device, a plurality of light-emitting elements 21 are mounted on a light-emission lead frame 31 and a plurality of light-receiving elements 22 are mounted on a light receiving lead frame 33. Common lead wires 41 to serve as common anode terminals on the light-emission side are connected to the respective element 21 internally and common lead wires 37 to serve as common emitter terminals on the light- receiving side are connected to the respective elements 22. Then, sealing with the use of resin is conducted by the primary metal molds 50 and 51. Afterwards, useless thick burrs of the resin are eliminated, and sealing is conducted with the use of black epoxy resin 29 by the secondary transfer mold. As a result, an optically coupled device is fabricated.</p> |
