发明名称 RESIN SEAL SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent generation of a clearance with respect to a sealing resin on the side face of an island, to form the apices of the projecting pieces at the end sections of the island of two straight lines, to disperse stress in a package and to prevent cracking of the package. CONSTITUTION:Projecting pieces 13 bent up and down alternately are formed at the end sections of an island 12, generation of a clearance respect to with a sealing resin 17 on the side faces of the island 12 is prevented positively while the apices of these projecting pieces 13 are formed of two straight lines, and stress in a package is dispersed.
申请公布号 JPH05251618(A) 申请公布日期 1993.09.28
申请号 JP19910266566 申请日期 1991.10.16
申请人 OKI ELECTRIC IND CO LTD 发明人 OKUAKI YUTAKA
分类号 H01L23/28;H01L23/50;(IPC1-7):H01L23/50 主分类号 H01L23/28
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