| 摘要 |
A thermal overload protection device for electronic components, in particular for the telecommunication and data technology. The overload device has a spring-elastic shorting link 6 and a melt element 13. Tripping of the shorting link 6 performed in dependence of the fusing process of the melt element 13. In order to obtain a SERVO FAIL SAFE behavior, the spring force of the shorting link 6 is arbitrarily high. Devices 15, 17, separate from each other, are provided, according to the invention, for separately tripping and actuating the shorting link 6.
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