| 摘要 |
PURPOSE:To form a semiconductor package in which deformation of lead frame and the interval of lead pitch are uniform by forming lead terminals onto an insulating substrate by printed wirings. CONSTITUTION:Lead terminals 1 for external leading-out are shaped by a plurality of printed wirings at regular intervals so as to correspond to the electrodes of a semiconductor chip 4 extending over side faces from the top face of a bottom insulating substrate 2. The lead terminals 1 are connected to the electrodes of the semiconductor chip 4 by bonding wires 5. The semiconductor chip 4, the bonding wires 5 and the whole section of the lead terminals 1 for external leading-out on the bottom insulating substrate 2 are sealed with a resin 3. The lead terminals are formed onto the insulating substrate by the printed wirings, thus preventing uneven deformation of the lead frame and the interval of the lead pitch. |
