MANUFACTURE OF CERAMIC CHIP CARRIER

摘要

PURPOSE:To prevent shortcircuit with ant adjacent through-hole and to divide a ceramic substrate without pulling a conductor to one side to cause breakage at a through-hole part or without generating cracks by applying cupric oxide paste of low viscosity whose volume is larger than that of copper to a through- hole which becomes a side electrode. CONSTITUTION:A green sheet wherein conductor print and via burying are carried out is thermo-compressed and laminated to form a through-hole. It is notched to connect each through-hole if necessary. Cupric oxide-based conductor paste is printed on the inner wall of a through-hole to form a conductor layer 35A. A lamination wherein print is performed is unbound and burnt in nitrogen atmosphere. A scribe line 41 is formed on a through-hole of the burnt substrate and the substrate is divided into pieces. Since cupric oxide paste applied to a through-hole is deoxidized and becomes a thin conductor film after burnt, a ceramic substrate can be divided into pieces without generating cracks, etc.