| 摘要 |
PURPOSE:To restrain melting viscosity of an electronic part sealing material, to improve fluidization, operativity and heat conductivity and to restrain abrasion of a die by forming an electronic part sealing filler of crystalline silicon dioxide particle having specified long and short axial ratio and roundness. CONSTITUTION:An electronic part sealing filler is composed of crystalline silicon dioxide particle. Therefore, when an electronic sealing material is manufactured, heat conductivity can be ensured by dispersing it to thermosetting resin as an inorganic matter. The silicon dioxide particles are contained 70wt.% or more, with long and short axial ratio of 1.20 to 1.40 and roundness of 0.75 to 0.90. Therefore, when an electronic part sealing material is manufactured through dispersion to thermosetting resin, it is possible to prevent deterioration of operativity due to increased abrasion of a die through increase of melting viscosity of an electronic part sealing material. |
