| 摘要 |
PURPOSE:To shorten the manufacturing time as a whole, improve productivity, and lower the manufacturing cost by laminating a insulated resin sheet to which the metal foil is fixed with a hole provided in advance in order to reduce the time for boring process. CONSTITUTION:On the surface of an inner layer circuit board 3, there is laminated an insulated resin sheet 6 to which a metal foil is fixed with a hole 9 provided in advance. Then, a plating layer 13 is formed in the hole 9 by a plating process. Further, an outer layer circuit 15 is formed to manufacture a multi- layered circuit board. |
