| 摘要 |
PURPOSE:To obtain a light laminate for a multilayered printed-circuit board, which is light, easily drillable, and highly resistant to metal migration. CONSTITUTION:The inner layer circuit board 1 is prepared by a paper-base phenol resin laminate on which the inner layer circuit is formed. This board is dehumidified. Then, with the paper-base phenol resin prepreg 3 as the bonding prepreg, an outer layer material such as a copper foil 4 is superposed, and hot pressed. |
