| 摘要 |
PURPOSE:To provide a solder bump forming material useful to improve durability and reliability of a semiconductor device by more reducing a distance between bump electrodes by further decreasing in diameter a wire, providing a solder bump forming material capable of expediting a high density mounting of an LSI, and stabilizing a ball separating position in the case of forming the bump using a wire obtained by a quick cooling solidifying method. CONSTITUTION:A solder bump forming material for a semiconductor element contains 0.001-1wt.% of Cu and 0.001-1wt.% of Ni added to any one essential element of Pb, Sn and In. A solder bump forming material for a semiconductor element is manufactured by forming mixed composition of the material in a fine wire state by a quick cooling solidifying method. |
