发明名称 |
Thermal connector with an embossed contact for a cryogenic apparatus |
摘要 |
A cryogenic system, such as a superconducting magnet assembly of magnetic resonance imaging equipment, is cooled by a refrigeration unit having a first surface refrigerated to a desired temperature. The first surface has a indentation in which an indium body is bonded to the first surface. A copper thermal conductor has a second surface on which an indenter is formed. Preferably the indenter is either a spiraling peak or an array of pyramids projecting from the second surface. A mechanism is provided to hold the thermal conductor against the indium body with the indenter penetrating the body.
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申请公布号 |
US5247800(A) |
申请公布日期 |
1993.09.28 |
申请号 |
US19920893135 |
申请日期 |
1992.06.03 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
MRUZEK, MICHAEL T.;ECKELS, PHILLIP W.;GOULDSBERRY, CLYDE L. |
分类号 |
F17C13/00;F25D19/00 |
主分类号 |
F17C13/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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