发明名称 BONDING WIRE INSPECTING APPARATUS
摘要 PURPOSE:To accurately detect an absolute height of a bonding wire by storing distribution information of a focus evaluated value and a focus position of the wire to be previously obtained, and imaging a few times at the focus position. CONSTITUTION:An inspecting apparatus comprises a camera 11 of imaging means, focus evaluated value calculating circuit 12, a picture processing memory 13 of distributed information storage means, a calculating circuit 14 of height calculating means, etc. Regarding a focus evaluated value distribution to be used for an inspection of an object S to be inspected, relationship between the height of a bonding wire 1 and the focus evaluated value is previously obtained by finely varying a focus position at an arbitrary position. The object S to be inspected is fed directly under the camera 11, and the wire 1 of the object S to be inspected is imaged at several positions of the focus position by the camera 11. Thus, an absolute height of the wire 1 is accurately obtained.
申请公布号 JPH05251540(A) 申请公布日期 1993.09.28
申请号 JP19920048856 申请日期 1992.03.05
申请人 FUJITSU LTD 发明人 TSUKAHARA HIROYUKI;OSHIMA YOSHITAKA;FUSE TAKASHI;ANDO MORITOSHI
分类号 G01B11/24;H01L21/60;H01L21/66;H01L21/82 主分类号 G01B11/24
代理机构 代理人
主权项
地址